Outreach Programs

Education Programs Technology Outreach Program International Programs Distinguished Lecturer Series International Center for Materials Research MRL Diversity Fellowship MRL Travel Fellowship

Intern: Grace Lee, UCSB Mentor: Hisashi Masui Faculty Supervisor: Steven DenBaars Department: Materials ans ECE

PACKAGE TECHNIQUES ON ULTRAVIOLET LIGHT EMITTING DIODES

Emerging developments of GaN-based light emitting diode (LED) have attracted considerable attention for practical application of solid-state lighting. Materials and techniques utilized in packaging optical devices play an important role in determining their performance. Currently, there is little understanding of packaging methods employed in technologically relevant LEDs will influence efficiency. In particular, ultraviolet (UV) LEDs on silicon carbide substrate fabricated with metal organic chemical vapor deposition (MOCVD) are investigated. The intent of this study is to ensure the consistency of UV LED performance by optimization of packaging techniques. Measurements of electrical and optical characteristics will be evaluated on unpackaged and packaged devices. Packaging procedure is accomplished through device die separation, sub-mount die attachment, contact wire bonding, and encapsulation methods. Surface characterization techniques, such as Atomic Force Microcopy (AFM) and Nomarski Microscope, will be employed to determine the adhesion in resulting wire-bonding contacts. Trends in performance associated with various packaging techniques will be reported.

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